Glossary

A:

Accessories

Activation 

Active Species

amorphous

Anion

anisotropic

Anode

anti adhesive

Anti Adhesive coating

Argon

Aspect ratio

Atmospheric Pressure Plasma

Atom   

   
 
 

B:

Barrel Reactor

Barrier layers

Bias Voltage

Bonding

Boron Silicate Glass 

 
 
 

D:

DBE  DBD  
Depolymerisation
Desmear Process
Diffusion  barrier
Di-Para-Xylylen
DLC

Downstream Plasma
Dry etching     

 
 

 

E:

Elastomere
Electrode
Electron
EPDM
Epilam layers
Etching

 

 
 

F:

Faraday
Fibre Reinforced Composite
Fluor
Flourescent tube
Fotolithography
Foto resist

G:

Gas charge
Gas discharge
Generator
GHz-Plasma system,
Glasfibre
glueing
Graphite


H:

HF-Generator

High puridity cleaning

HMDSO

High Frequency

High puridity plasma cleaning

High voltage

High puridity surface 

Hydrocarbon

Hydrogene

hydrophilic

hydrophobic

I:

IC
ICP Inductively Coupled Plasma
Induction
Inert gas
Ion etching
Ionisation
ISM
isotropic

K:

 

L:

LABS-free
Langmuir probe
lipophilic
lipophobic
Lithography
LOC Lab-on-Chip
Low pressure plasma
Low temperature plasma

M:

Magnetron
Mask
MEMS
MFC Mass Flow Controller
Microfluidics
Microplasma
Micro Sandblasting
Microwave plasma
Monomer

N:

Needle valve
Nanotechnology
Neon

O:

O ring
oleophobic


P:

Painting
Parylene
PDMS
Photovoltaic
Physical etching
Plasma
Plasma etching
Plasma activation
Plasma cleaning
Plasma system
Plasma coating
Plasma polymerisation
Plasmastick
Plastic
Plastic activation
Polymer
Precursor
Process gas
PTFE
PVD

Q:

Quartz glas

R:

Radicals
Recipient
RIE
Rotary Drum
Rubber

S:

sccm
Self-BIAS
Semiconductor
Silicon
sputtering
Stainless Steel
Sterilisation
Surface cleaning
Surface energy
Surface tension
Surface treatment

T:

Target
Teflon
Test ink
Tetrafluormethane
Textile treatment


U:

UV radiation

V:

Vacuum
Vacuum chamber
Vacuum pump
Valence electron

W:

Wafer
Wetting

Z: